MOSFET Failure Analysis: Kev nkag siab, Kev Tiv Thaiv, thiab kev daws teeb meem

MOSFET Failure Analysis: Kev nkag siab, Kev Tiv Thaiv, thiab kev daws teeb meem

Lub sij hawm xa tuaj: Dec-13-2024

Cov txheej txheem ceev:MOSFETs tuaj yeem ua tsis tiav vim muaj ntau yam hluav taws xob, thermal, thiab kev ntxhov siab. Kev nkag siab txog cov hom kev ua tsis tiav no yog qhov tseem ceeb rau kev tsim cov tshuab hluav taws xob hluav taws xob txhim khu kev qha. Phau ntawv qhia ntxaws no tshawb txog cov txheej txheem ua tsis tiav thiab cov tswv yim tiv thaiv.

Nruab nrab-ppm-rau-Various-MOSFET-Failure-ModesFeem ntau MOSFET Failure Modes thiab lawv cov hauv paus ntsiab lus

1. Voltage-Related Failures

  • Lub rooj vag oxide tawg
  • Avalanche tawg
  • Punch-los ntawm
  • Static paug puas tsuaj

2. Thermal-Related Failures

  • Secondary kev puas tsuaj
  • Thermal khiav
  • Pob delamination
  • Bond hlau lift-off
Hom kev ua tsis tiav Yam Tseem Ceeb Cov cim ceeb toom Txoj kev tiv thaiv
Rooj vag Oxide Breakdown Tshaj VGS, ESD cov xwm txheej Nce qhov rooj nkag Lub rooj vag voltage tiv thaiv, ESD ntsuas
Thermal Runaway Ntau dhau lub zog dissipation Nce kub, txo kev hloov ceev Zoo thermal tsim, derating
Avalanche tawg Cov hluav taws xob hluav taws xob, tsis muaj kev sib hloov inductive Cov khoom siv hluav taws xob luv luv Snubber circuits, voltage clamps

Winsok's Robust MOSFET Solutions

Peb tiam tshiab ntawm MOSFETs nta cov txheej txheem tiv thaiv qib siab:

  • Txhim kho SOA (Safe Operating Area)
  • Txhim kho thermal ua haujlwm
  • Ua-hauv ESD tiv thaiv
  • Avalanche-rated designs

Kev soj ntsuam ntxaws txog kev ua tsis tiav

Rooj vag Oxide Breakdown

Qhov tseem ceeb Parameter:

  • Qhov siab tshaj plaws qhov rooj-qhov Voltage: ± 20V raug
  • Rooj vag Oxide Thickness: 50-100nm
  • Lub zog ntawm lub zog: ~ 10 MV / cm

Kev tiv thaiv:

  1. Siv lub rooj vag voltage clamping
  2. Siv series rooj vag resistors
  3. Nruab TVS diodes
  4. Cov txheej txheem PCB tsim nyog

Thermal Management thiab Failure Prevention

Hom pob Max Kev Sib Txuas Temp Pom zoo Derating Txias Solution
TSI-220 175 ° C 25% Heatsink + Ntxuam
D2 PAB 175 ° C 30% Loj Copper Area + Xaiv Heatsink
TSO-23 150 ° C 40% PCB Copper Pour

Qhov Tseem Ceeb Tsim Cov Lus Qhia rau MOSFET Kev Ntseeg

PCB Layout

  • Minimize lub rooj vag voj cheeb tsam
  • Cais lub zog thiab teeb liab hauv av
  • Siv Kelvin qhov chaw txuas
  • Optimize thermal vias tso

Kev tiv thaiv Circuit Court

  • Siv cov hluav taws xob pib hluav taws xob
  • Siv cov snubers tsim nyog
  • Ntxiv kev tiv thaiv rov qab voltage
  • Saib xyuas cov cuab yeej kub

Cov txheej txheem kuaj thiab kuaj

Basic MOSFET Testing Protocol

  1. Static Parameters Test
    • Lub rooj vag voltage (VGS(th))
    • Drain-source on-resistance (RDS(on))
    • Gate leakage tam sim no (IGSS)
  2. Kev kuaj Dynamic
    • Hloov sijhawm (ton, toff)
    • Lub rooj vag them tus yam ntxwv
    • Tso zis capacitance

Winsok's Reliability Enhancement Services

  • Comprehensive daim ntawv thov tshuaj xyuas
  • Thermal tsom xam thiab optimization
  • Kev ntsuas kev ntseeg tau thiab kev siv tau
  • Kev soj ntsuam tsis ua hauj lwm hauv chav kuaj kev txhawb nqa

Reliability Statistics thiab Lifetime Analysis

Kev ntsuas kev ntseeg tau tseem ceeb

FIT Rate (Failures In Sijhawm)

Tus naj npawb ntawm kev ua tsis tiav ib billion ntaus ntawv-teev

0.1-10 TSI

Raws li Winsok qhov tseeb MOSFET series nyob rau hauv nominal tej yam kev mob

MTTF (Lub Sijhawm Ua Tsis Tau)

Cia siab rau lub neej raws li cov xwm txheej tshwj xeeb

> 10^6 teev

Ntawm TJ = 125 ° C, nominal voltage

Ciaj sia taus

Feem pua ​​ntawm cov cuab yeej muaj sia nyob dhau lub sijhawm lav

99.9%

Thaum 5 xyoos ntawm kev ua haujlwm tas mus li

Lub Neej Derating Factors

Kev Ua Haujlwm Derating Factor Kev cuam tshuam rau lub neej
Kub (txog 10 ° C saum 25 ° C) 0.5x ib 50% txo
Voltage Stress (95% ntawm max ntsuam xyuas) 0,7x ib 30% txo
Hloov zaus (2x nominal) 0,8x ib 20% txo
Humidity (85% RH) 0,9x ib 10% txo

Lub Neej Muaj Peev Xwm Distribution

duab (1)

Weibull kev faib tawm ntawm MOSFET lub neej qhia txog kev ua tsis tiav thaum ntxov, kev ua tsis tiav, thiab lub sijhawm hnav

Environmental Stress Factors

Kub Cycling

85%

Kev cuam tshuam rau kev txo qis hauv lub neej

Lub zog Cycling

70%

Kev cuam tshuam rau kev txo qis hauv lub neej

Mechanical Stress

45%

Kev cuam tshuam rau kev txo qis hauv lub neej

Cov txiaj ntsig ntawm Kev Ntsuam Xyuas Lub Neej Ceev

Hom kev xeem Cov xwm txheej Duration Failure Rate
HTOL (High Temperature Operating Life) 150 ° C, Max VDS 1000 teev <0.1%
THB (Tsub Humidity Bias) 85 ° C / 85% RH 1000 teev <0.2%
TC (Cycling kub) -55 ° C rau + 150 ° C 1000 cycles <0.3%

Winsok's Quality Assurance Program

2

Kev tshuaj ntsuam xyuas

  • 100% kev kuaj ntau lawm
  • Kev txheeb xyuas qhov ntsuas
  • Cov yam ntxwv dynamic
  • Kev tshuaj xyuas qhov muag

Kev Xeem Txuj Ci

  • Environmental stress screening
  • Kev txheeb xyuas kev ntseeg tau
  • Package kev kuaj xyuas
  • Kev saib xyuas kev ntseeg tau ntev